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Infineon Technologies Americas Corp., El Segundo, United States

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Infineon Technologies Americas Corp.

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Infineon Technologies Americas Corp.

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Name

Infineon Technologies Americas Corp.

Identification

Lei
5493000GP8VTVR5B8R33

Address

North Sepulveda Boulevard 101, El Segundo 90245, United States

History

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Publications

20 May 2026
Patent: Synchronized control of sensors in an Ethernet network
7 Jan 2026
Patent: Configurable Transfer Rates Over a TWO-Way Ethernet Link
Year 2025 in Epobase
4 European patent filings: Improved Bandwidth for Wirebond Integrated Circuit Package …
Year 2024 in Epobase
4 European patent filings: Grounding Optimization for Unshielded Data Connections …
30 May 2024
Wordmark: “AU-ConvertiR“
29 Feb 2024
Wordmark: “AU-ControlliR“
Year 2023 in Euipotm
8 wordmarks: COOLiRDiode, COOLiR²Diode, COOLiR²FET, PowIR'd by IR …
21 Jun 2023
Patent: Controlled Resistance Integrated Snubber for Power Switching Device
via CVR in Cvrpc
Shareholdings: Micross Hi Rel Power Solutions ApS, Micross Hi Rel Power Solutions ApS · VR: Micross Hi Rel Power Solutions ApS, Micross Hi Rel Power Solutions ApS …
23 Feb 2023
Patent: Direct encapsulation of sensor data via Ethernet
9 Jan 2023
Patent: Synchronized control of sensors in an Ethernet network
28 Sept 2022
Patent: Gate and field electrode trenching process
Year 2022 in Euipotm
32 trademark filings (31 wordmarks, 1 word figurative mark): BRIGHTLANE, COOLiR-Stack, COOLiRIGBT, COOLiR², COOLiR²-Stack, COOLiR²Bridge, COOLiR²Die, COOLiR²Drive, COOLiR²IGBT, COOLiR²Mod(ule) …
Year 2021 in Epobase
21 European patent filings: Control Chip for a Power Inverter Comprising Voltage Level Shifters …
1 Jul 2021
Wordmark: “PowIRStage“
15 Feb 2021 via Infineon Technologies AG also 20/01/2021, 23/12/2019, 10/12/2019, 07/01/2019, 17/12/2018, 02/03/2018, 15/01/2018, 12/12/2017, 02/01/2017
Shareholder: Infineon Technologies AG
14 Dec 2020
Wordmark: “IOT-ADVANTEDGE“
Year 2020 in Epobase
25 European patent filings: Power Converter Package Including top-Drain Configured Power FET …
2 Jul 2020
Wordmark: “GANPOWIR“
Year 2019 in Epobase
32 European patent filings: Method of Manufacturing a High Voltage Cascoded III-Nitride Rectifier Package with Etched Leadframe …
2 Jul 2019
Wordmark: “iMOTION“
Year 2018 in Epobase
17 European patent filings: Thermally Enhanced Semiconductor Package due to an Exposed Conductive Clip …
9 Mar 2018
Word figurative mark: “μPFC“
Year 2017 in Epobase
8 European patent filings: Gallium Nitride Material Devices Including Backside Vias and Methods of Fabrication …
14 Nov 2016
Wordmark: “EMBEDDED IN TOMORROW“
29 Jun 2016
Patent: Monolithic Integrated Composite Group III-V and Group IV Semiconductor Device and Method for Fabricating Same
18 Jan 2016
Word figurative mark: “AND“
15 Jan 2016
Wordmark: “International Rectifier“
Year 2015 in Epobase
5 European patent filings: Packaged Assembly for High Density Power Applications …
Year 2014 in Epobase
20 European patent filings: Group III-V Device Including a Buffer Termination Body …
Year 2013 in Epobase
10 European patent filings: Power Quad Flat no-Lead (Pqfn) Semiconductor Package with Leadframe Islands for Multi-Phase Power Inverter …
25 Mar 2013
Wordmark: “COOLiRFET“
18 Oct 2012
Figurative mark
Year 2012 in Epobase
19 European patent filings: Group III-V Device Structure Having a Selectively Reduced Impurity Concentration …
9 Aug 2011
Wordmark: “COOLiR“
5 Mar 2011
Patent: Programmable III-nitride transistor with aluminum-doped gate
15 Feb 2011
Patent: In Situ Dopant Implantation and Growth of a III-Nitride Semiconductor Body
11 Feb 2011
Patent: Monolithic Integration of Silicon and Group III-V Devices
28 Apr 2010
Patent: Monolithic Vertically Integrated Composite Group III-V and Group IV Semiconductor Device and Method for Fabricating Same
30 Mar 2010
Wordmark: “CAPSENSE“
19 Jan 2009
Wordmark: “PSoC“
16 Mar 2007
Patent: Improved Chip-Scale Package
5 Jan 2007
Patent: Substrate and Method for Mounting Silicon Device
29 Dec 2006
Patent: Vertical DMOS arrangement in an integrated circuit
16 Aug 2006
Patent: Power Semiconductor Device with Interconnected Gate Trenches
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21 Feb 2026 in Ler
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21 Feb 2026 in Ler
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