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EU funding (€25M): 14 Angstroms Module Integration Hor1 May 2023 EU Research and Innovation programme "Horizon"

Overview

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14 Angstroms Module Integration

The 14AMI project is about creating technological solutions for the 14 Angstrom CMOS technology node, including a fully integrated functional CFET (Complementary Field Effect Transistor) as new active CMOS device, and state-of-the-art holistic metrology techniques for both wafer and mask inspection and review. All is aimed to keep the pace in the industry to follow “Moore’s law”. The project addresses the following 3 main pillars that are relevant in enabling manufacture of 14A technology, 1) lithography, 2) metrology and 3) process module integration. In lithography the aim is to realize solutions for the 0.55NA EUV scanner platform to secure 14Angstrom node compliance in performance, that is, resolution, alignment, throughput and optics lifetime. In Metrology the objective is to cover wafer and mask metrology and quality control. The aim is to develop holistic metrology, tools & methods and data analytics to improve overlay, CD and focus measurement and quality control with a Precision to Tolerance, P/T, ratio between 0.1 and 0.3. In process module integration work covers the realization and demonstration of a CFET – Complementary Field Effect Transistor - CMOS device. Three options will be investigated for integration; a monolithic, sequential and a hybrid solution. In addition, the partners will develop a PFAS-free photo resist to reduce the ecological footprint of photolithography processes, and a smart AI based sensor technology to improve vacuum chambers' efficiency and reduce waste. At societal level the expected impact of the 14AMI project will support the partners and their supplier network to stay at the leading edge of high-tech developments, crucial to meet the digitization challenges of the European society. Moreover, 14AMI will “boost industrial competitiveness”, and attract talent in Europe, while enabling new application in areas such as security, communication and enabling of further automation in mobility, health and research.


Funded Companies:

Company name Funding amount
CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENT ?
APPLIED MATERIALS ISRAEL Ltd. €721,250
ASML NETHERLANDS B.V. €3,917,655
BERGISCHE UNIVERSITAET WUPPERTAL €242,392
BRUKER TECHNOLOGIES Ltd. €338,000
CARL ZEISS SMT GmbH €2,280,377
DECOM KRYOZ B.V. €0.00
DEMCOM MANAGEMENT & SUPPORT B.V. €0.00
DEMCON BUNOVA B.V. €0.00
DEMCON ENGINEERING B.V. €0.00
DEMCON FOCAL B.V. €0.00
DEMCON HIGH-TECH SYSTEMS DELFT B.V. €0.00
DEMCON HIGH-TECH SYSTEMS EINDHOVEN B.V. €0.00
DEMCON HIGH-TECH SYSTEMS ENSCHEDE B.V. €0.00
DEMCON LIFE SCIENCES & HEALTHEINDHOVEN B.V. €0.00
DEMCON LIFE SCIENCES & HEALTH ENSCHEDE B.V. €747,718
EV Group E. Thallner GmbH €566,705
FASTMICRO B.V. €360,000
FEI ELECTRON OPTICS B.V. €971,750
FLEXIBLE OPTICAL B.V. €253,885
FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG e. V. €1,190,223
ICT Integrated Circuit Testing GmbH €743,600
Interuniversitair Micro-Electronica Centrum €4,275,429
JSR Micro N.V. €89,062
KLA-TENCOR CORPORATION (ISRAEL) €669,642
NEARFIELD INSTRUMENTS B.V. €455,662
NEDERLANDSE ORGANISATIE VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO €997,492
NOVA Ltd. €764,725
NOVA MEASURING INSTRUMENTS GmbH €541,250
Pfeiffer Vacuum €430,528
Plansee SE €523,553
Recif Technologies €287,014
REDEN B.V. €255,000
RHEINISCH-WESTFAELISCHE TECHNISCHE HOCHSCHULE AACHEN €643,700
TECHNISCHE UNIVERSITEIT DELFT €154,543
TECHNISCHE UNIVERSITEIT EINDHOVEN €300,280
Universitatea Nationala de Stiintasi Tehnologie Politehnica Bucuresti €645,313
UNIVERSITEIT TWENTE €987,744
VDL ETG TECHNOLOGY & DEVELOPMENT B.V. €599,656

Source: https://cordis.europa.eu/project/id/101111948

The filing refers to a past date, and does not necessarily reflect the current state. The current state is available on the following page: CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement, Neuchâtel, Switzerland.