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EU funding (€28.2M): Technology Advances for Pilotline of Enhanced Semiconductors for 3nm Hor 28 Jun 2018 EU Research and Innovation programme "Horizon"

Overview

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Technology Advances for Pilotline of Enhanced Semiconductors for 3nm

"In line with industry needs, Moore’s law, scaling in ITRS 2013, and ECSEL JU MASP 2017, the main objective of the TAPES3 project is to discover, develop and demonstrate lithographic, metrology, EUV mask technology, devices and process modules enabling 3nm node technology. This is planned with available EUV/NA 0.33 scanners, and with system design and integration of a new hyper NA EUV lithography tool to enable more single exposure patterning at 3nm to create complex integrated circuits. Process steps for 3D devices as alternative to the conventional FINFet will be explored for application in the 3nm node. The impact of the application of these so called 3D devices on circuit topology and logic design will be explored. During the development, specific challenges in metrology for the characterization of 3D devices will be assessed and metrology tools will be newly developed. The result will be demonstrated in the imec pilot line. The TAPES3 project relates to the ECSEL work program topic Equipment, Material and Manufacturing. It addresses and targets, as set out in MASP, the grand Challange of ""More Moore Equipment and Materials for sub 10nm technologies"" by exploring the requirements and solutions for the 3nm node. The project touches the core of the continuation of Moore’s law. Moreover, the cost aware development process will support the involved companies, and will place them in a preferred position over their worldwide competition. Through their worldwide affiliations, the impact of the TAPES3 project will be felt outside Europe in America and Asia Pacific semiconductor centers and is expected to benefit the European economy a lot by supporting its semiconductor equipment and metrology sectors with innovations, exports and employment."


Funded Companies:

Company name Funding amount
Advanced Mask Technology Center GmbH & Co. KG €80,488
Applied Materials Belgium €71,562
Applied Materials Israel Ltd. €1,462,650
Asml Netherlands B.V. €7,577,677
Carl Zeiss SMT GmbH €4,156,250
Coventor Sàrl €358,803
Demcon Bunova B.V. €0.00
Demcon High-Tech Systems Enschede B.V. €0.00
Demcon Industrial Systems Groningen B.V. €0.00
Demcon Innovation & Technology B.V. €0.00
Demcon Life Sciences & Healtheindhoven B.V. €0.00
Demcon Life Sciences & Health Enschede B.V. €345,000
Demcon Production B.V. €0.00
FEI Electron Optics B.V. €845,012
Fraunhofer Gesellschaft ZUR Forderung DER Angewandten Forschung e. V. €387,050
Institut Fuer Mikroelektronik Stuttgart €867,464
Interuniversitair Micro-Electronica Centrum €7,371,530
Ion Beam Services €274,096
JSR Micro N.V. €92,061
KLA-Tencor Corporation (Israel) €346,185
LAM Research AG €0.00
LAM Research Belgium €0.00
Nederlandse Organisatie Voor Toegepast Natuurwetenschappelijk Onderzoek TNO €634,375
Nova Ltd. €943,250
Optix FAB GmbH €168,438
Oxford Instruments Nanotechnology Tools Ltd. €29,736
Paul Scherrer Institut €134,952
Physikalisch-Technische Bundesanstalt €187,396
Recif Technologies €119,192
Rheinisch-Westfaelische Technische Hochschule Aachen €169,906
Siemens Electronic Design Automation Sàrl €0.00
Siemens Industry Software A Limitedliability Company Under THE Privatefree Zones Regime €0.00
Siemens Industry Software N.V. €183,675
Siltronic AG €457,088
Suss Microtec Solutions GmbH & Co. KG €37,500
VDL Enabling Technologies Group B.V. €0.00
VDL Enabling Technologies Group Eindhoven B.V. €0.00
VDL ETG Technology & Development B.V. €891,603

Source: https://cordis.europa.eu/project/id/783247

The filing refers to a past date, and does not necessarily reflect the current state.