European Companies Search Engine

EU funding (€28M): 300mm Pilot Line for Smart Power and Power Discretes Hor22 May 2017 EU Research and Innovation programme "Horizon"

Overview

Text

300mm Pilot Line for Smart Power and Power Discretes

R3-POWERUP will push through the new generation of 300mm Pilot Line Facility for Smart Power technology in Europe. This will enable the European industry to set the world reference of innovative and competitive solutions for critical societal challenges, like Energy saving and CO2 Reduction (ref. to COP21 Agreement ), as well as Sustainable Environment through electric mobility and industrial power efficiency. ● Development and demonstration of a brand new 300mm advanced manufacturing facility addressing a multi-KET Pilot Line (i.e. Nanoelectronics, Nanotechnology, Advanced Manufacturing) ● Improvement in productivity and competitiveness of integrated IC solutions for smart power and power discrete technologies. The strategy of the project is the following: ● The Pilot Line will enable the realization of sub-100nm Smart Power processes, starting from the 90nm BCD10 process, taking profit from the advanced and peculiar equipments available only for 300mm wafer size. ● The availability of a 300mm full processing line will also exploit the portability to 300mm of the most critical and expensive process steps devoted to power discrete devices. ● The Pilot Line will build on Digital Factory and Industry 4.0 principles, enforcing a flexible, adaptive and reliable facility, in order to investigate also the synergy and economic feasibility of supporting both Smart Power and power discrete processes in the same manufacturing line. ● The application of such technologies will be a breakthrough enabler for Energy Efficiency and CO2 Reduction worldwide, in line with COP21’s global action plan. The Pilot Line is based on three main pillars: 1. Market driven continuous innovation on smart-power and power discrete; 2. Industrial policy focused on high quality and mass production’s cost optimization; 3. Set the ground for future wafer upgrade of “More than Moore” disruptive technologies (e.g. advanced MEMS manufacturing, now at 200mm)


Funded Companies:

Company name Funding amount
ADVANCED PACKAGING CENTER B.V. €170,000
Alma Mater Studiorum - Universita Di Bologna €0.00
AP&S INTERNATIONAL GmbH €93,750
Applied Materials France €23,911
Applied Materials Ireland Ltd. €54,791
APPLIED MATERIALS ISRAEL Ltd. €300,000
ASM EUROPE B.V. €52,950
ATOTECH DEUTSCHLAND GmbH €40,000
Besi Austria GmbH €240,000
Consiglio Nazionale Delle Ricerche €122,500
Consorzio Nazionale Interuniversitario Per LA Nanoelettronica €385,000
DISCO HI-TEC EUROPE GmbH €120,000
EV Group E. Thallner GmbH €92,803
Green Power Technologies SL €125,000
Icos Vision Systems N.V. €318,000
Institut Mikroelektronickych Aplikaci s.r.o. €74,531
KLA-Tencor MIE GmbH €276,250
LAM Research SAS €70,000
Laser Systems & Solutions OF Europe €59,733
Nano Design s.r.o. €42,500
NOVA Ltd. €100,000
NOVA MEASURING INSTRUMENTS GmbH €80,000
PICOSUN Oy €300,000
Politecnico Di Milano €0.00
Politecnico Di Torino €122,500
ROBERT BOSCH GmbH €594,086
Siec Badawcza Lukasiewicz - Instytut Mikroelektroniki i Fotoniki €139,650
SILTRONIC AG €100,000
Slovenska Technicka Univerzita V Bratislave €98,000
Soitec SA €99,996
Stmicroelectronics Srl €23.2M
Tritem sp. z o.o. €50,000
Universidad de Sevilla €106,164
Universita Degli Studi Di Padova €0.00
Universita Degli Studi Di Pavia €122,500
Universita Degli Studi Di Udine €0.00
Universita Di Pisa €122,500
Universitatea Politehnica Din Bucuresti €0.00
Vysoke Uceni Technicke V Brne €105,000

Source: https://cordis.europa.eu/project/id/737417

The filing refers to a past date, and does not necessarily reflect the current state.