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EU funding (€7,269,829): Challenging environments tolerant Smart systems for IoT and AI Hor1 Jun 2020 EU Research and Innovation programme "Horizon"

Overview

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Challenging environments tolerant Smart systems for IoT and AI

Digitalization has been identified as one of the key enablers for renewal and competitiveness of European manufacturing industries. However, grasping the digitalization and IoT-related opportunities can be limited by the harsh environmental conditions of the manufacturing processes and end use environments. The ECSEL-IA 2019 project initiative CHARM aims to contribute to solving this problem by developing ECS technologies that tolerate harsh industrial environments. The project concept centres around real industrial challenges from different types of end use industries. The synergies and impacts arise from similarities in technology solutions serving different applications and industry sectors. The CHARM Use Cases include six different industry sectors, majority of them presented by innovative cutting-edge large enterprises that belong to the world-wide market leaders of their own sectors – while most of them being new to the ECSEL ecosystem: mining (Sandvik Mining and Construction Oy, FI), paper mills (Valmet Technologies Oy, FI), machining (Tornos SA, CH), solar panel manufacturing lines (Applied Materials Italia SRL, IT), nuclear power plants maintenance and decommissioning (ÚJV Řež a.s., CZ), and professional digital printing (Océ-Technologies B.V, NL). The planned demonstrators engage these big players with European ECS value chains and showcase capabilities that serve manufacturing industries’ needs at large. The new technologies to be developed include novel multi-gas sensors, robust high temperature and pressure sensors, flexible sensors for paper machine rolls, wireless power transfer systems, connectivity solutions for rotating parts, advanced vision systems, and enablers for autonomous driving. The project consortium includes 12 SMEs, 14 LEs and 12 RTOs, and covers the industrial value chains from simulations, sensors and components to packaging, integration and reliability as well as connectivity, cloud and cyber security solutions.


Funded Companies:

Company name Funding amount
Aixacct Systems GmbH €148,227
Applied Materials Italia Srl €312,500
AT & S Austria Technologie & Systemtechnik AG €349,824
Beneq Oy €259,150
Besi Austria GmbH €392,375
Besi Netherlands B.V. €37,875
Canon Production Printing Netherlands B.V. €169,988
Consorzio Nazionale Interuniversitario Per LA Nanoelettronica €863,625
Csem Centre Suisse D'Electronique ET DE Microtechnique SA - Recherche ET Developpement €295,289
E + E Elektronik GmbH €123,250
Fraunhofer Gesellschaft ZUR Forderung DER Angewandten Forschung e. V. €275,727
Innosent GmbH €193,500
Lapin Ammattikorkeakoulu Oy €287,088
Luna Geber Engineering Srl €72,781
Materials Center Leoben Forschung GmbH €245,075
Nome Oy €90,813
Pac Tech - Packaging Technologies GmbH €173,375
Qplox Engineering €81,160
Quantavis Srl €215,000
Reden B.V. €79,111
Rigas Tehniska Universitate €119,009
SAF Tehnika AS €82,406
Sandvik Mining AND Construction Oy €55,040
Siec Badawcza Lukasiewicz - Instytut Mikroelektroniki i Fotoniki €204,750
Smartmotion s.r.o. €89,375
SSH Communications Security Oyj €278,685
Stichting Imec Nederland €215,110
Sylvac SA €197,104
Tampereen Korkeakoulusaatio sr €255,393
Technische Universitaet Chemnitz €126,597
Technische Universiteit Delft €209,484
Tipb Toegepaste Industriele Procesbeheersing €93,538
Tornos SA €51,601
Ujv Rez AS €155,503
Universita Degli Studi Di Perugia €0.00
Universita Di Pisa €0.00
Valmet Technologies Oy €184,445
Wurth Elektronik GmbH & Co. KG €89,700
Zapadoceska Univerzita V Plzni €196,359

Source: https://cordis.europa.eu/project/id/876362

The filing refers to a past date, and does not necessarily reflect the current state.