European Companies Search Engine

EU funding (€96.2M): Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems Pilot Line Hor1 Nov 2024 EU Research and Innovation programme "Horizon"

Text

Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems Pilot Line

As a contribution to the EU Chips Act, the Research Fab Microelectronics Germany (FMD) proposes an Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems Pilot Line (APECS-PL), which combines the generation of globally competitive high technology that addresses the specific needs of German and European industry and enables a low-threshold, easily scalable industrial transfer. The APECS-PL will include novel characterization, quality assurance, testing & reliability methodologies, test methods to assess the security of microelectronic systems against physical attacks and a System Technology Co Optimization (STCO) framework. Together with the 2 nm GAA (imec), 5 nm FDSOI (Leti) and wide bandgap semiconductor pilot lines also planned within the EU Chips Act, the APECS-PL is also in a position to become an essential component on the way to the vision of a pan-European pilot line facility - and thus an indispensable pillar for achieving the EU Chips Act target of bringing 20% of the global supply of chip production back to Europe. In addition, APECS-PL offers a one-stop shop for a very broad international customer base in basically all classic vertical industrial sectors including large companies, SMEs and technology start-ups. Demonstrators are planned to evaluate how the elements of the pilot line work together. The FMD-OFC office, managed by Fraunhofer as legal entity, is responsible for operational management. As a first step for additional European R&D partners the project partners imec, Leti, VTT, IMB-CNM (CSIC), INL, Forth and TU Graz will be included. The shortage of skilled workers and scientists is of particular interest in the project. Better integration of a gender dimension into research and innovation content will be an essential part of the project. Systematic eco-design that generally minimizes energy and resource consumption is in line with the EU Green Deal.


Funded Companies:

Company name Funding amount
Agencia Estatal Consejo Superior de Investigaciones Cientificas €587,336
Commissariat a L Energie Atomique et aux Energies Alternatives €2,948,242
FERDINAND-BRAUN-INSTITUT gGmbH LEIBNIZ- INSTITUT FUR HOCHSTFREQUENZTECHNIK €5,451,448
FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG e. V. €76.4M
Idryma Technologias Kai Erevnas €616,000
IHP GmbH - LEIBNIZ INSTITUTE FOR HIGH PERFORMANCE MICROELECTRONICS €3,494,926
International Iberian Nanotechnology Laboratory €2,000,000
Interuniversitair Micro-Electronica Centrum €1,963,621
Technische Universitaet Graz €421,702
TEKNOLOGIAN TUTKIMUSKESKUS VTT Oy €2,323,732

Source: https://cordis.europa.eu/project/id/101183307

The filing refers to a past date, and does not necessarily reflect the current state.

Creative Commons License The visualizations for "Agencia Estatal Consejo Superior de Investigaciones Cientificas - EU funding (€96.2M): Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems Pilot Line" are provided by North Data and may be reused under the terms of the Creative Commons CC-BY license.