European Companies Search Engine
EU funding (€5,760,077): Multi-functional In-Mold Electronics Hor1 Jan 2024 EU Research and Innovation programme "Horizon"
Overview
Text
Multi-functional In-Mold Electronics
Film insert molding and in-mold decoration are standard processes in injection molding allowing to generate 3D shaped objects with seamlessly integrated graphics and high freedom in design. With the emerging functional printing of circuits and sensors, the field of in-mold electronics has extremely expanded covering several applications (i.e., Human Machine Interface in automotive and industries, condition monitoring and sensors in energy generation field, healthcare, etc.). The entire manufacturing process for in-mold electronics includes several sub-processes, most of which have a high yield of ~ 99%. However, the yield for overmolding, which is crucial for the production of complex products, is 85% at best, resulting in an overall yield that is far too low and requires high tooling and process optimization costs. Since nowadays in-mold electronic products are multi-material compounds that are difficult to recycle they do not meet the requirements of European society and policy on sustainability and circularity. The currently used capacitive sensors are not usable with cold fingers or gloves and do not provide haptic feedback, thus leading to an unsatisfactory user experience. Moreover, the direct lightning by LEDs placed in the vicinity of capacitive sensors generates a substantial heat inside the injection-molded part, leading to low durability and bad user experience in the Human Machine Interface. To overcome these limitations the objective of the MULTIMOLD project is to develop the next generation manufacturing process for products with complex geometries based on in-mold electronics with a robust, weather-resistant material concept that provides inherent recyclability by design. The MULTIMOLD complex products will combine advanced electronic functionality, multimodal sensors, haptic feedback, and power supply with micro- and nanostructured functional surfaces that may be light guiding, anti-bacterial, anti-icing, easy-to-clean and have appealing textures.
Funded Companies:
| Company name | Funding amount |
| Eologix Sensor Technology GmbH | €275,208 |
| FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG e. V. | €764,992 |
| HTP High Tech Plastics GmbH | €181,046 |
| Interuniversitair Micro-Electronica Centrum | €781,261 |
| Joanneum Research Forschungsgesellschaft mbH | €1,268,929 |
| Montanuniversitaet Leoben | €460,111 |
| Nanogate Central AND Eastern Europepe GmbH | €274,080 |
| R2M Solution Srl | €316,800 |
| Schneider Electric Industries SAS | €399,622 |
| Standex Engraving Italy | €0.00 |
| Standex International Srl | €4,000.00 |
| Syxis VSI | €509,427 |
Source: https://cordis.europa.eu/project/id/101138427
The filing refers to a past date, and does not necessarily reflect the current state.
The visualizations for "Eologix Sensor Technology GmbH - EU funding (€5,760,077): Multi-functional In-Mold Electronics"
are provided by
North Data
and may be reused under the terms of the
Creative Commons CC-BY license.
