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UK funding (£1,132,761): Advanced Design, Partitioning and Test for System-in-Package Electronics Ukri1 May 2006 UK Research and Innovation, United Kingdom

Overview

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Advanced Design, Partitioning and Test for System-in-Package Electronics

Abstract The ADEPT-SiP project is directed at the development and demonstration of a rigorous, right-first-time design and supply chain management methodology for novel System-in-Package Electronics Product Functions. The project will address schematic capture, partitioning and active device, substrate and package design to meet specific performance, cost, size and weight targets. Other key design stages will include thermal and EMC design, and design-for-manufacture, test, reliability and for environmental impact. Novel, high density embedded passive substrate technologies will be designed and simulated, process characterisation undertaken and parameterised component models developed for the full range of passive components and interconnection and assembly structures. The core design, simulation and modelling activities will be proven in System-in-Package technology demonstrators.
Category Collaborative R&D
Reference 100037
Status Closed
Funded period start 01/05/2006
Funded period end 31/01/2010
Funded value £1,132,761.00
Source https://gtr.ukri.org/projects?ref=100037

Participating Organisations

TWI LIMITED

£345,416.00

QUANTUM COMPUTER AIDED DESIGN LIMITED

£63,557.00

WURTH ELECTRONICS UK LIMITED

£84,698.00

FILTRONIC BROADBAND LIMITED

£61,779.00

UNIVERSITY OF LEEDS

£352,401.00

FLOMERICS LIMITED

£74,906.00

MHS ELECTRONICS UK LIMITED

£51,303.00

ZUKEN UK LIMITED

£98,701.00

The filing refers to a past date, and does not necessarily reflect the current state. The current state is available on the following page: TWI Ltd., Cambridge.

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