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EU funding (€20.8M): IC Technology for the 2nm Node Hor1 Jun 2020 EU Research and Innovation programme "Horizon"
Overview
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IC Technology for the 2nm Node
The overall objective of the IT2 project is to explore, develop and demonstrate technology options that are needed to realize 2nm CMOS logic technology extending the scaled Semiconductor technology roadmap to the next node in accordance to Moore’s law. These activities cover creation of Lithography equipment, new Processes & Modules and Metrology tools capable to create and deal with new 2nm node 3D structures, defect analysis, overlay and features. The topics addressed by the program relate to the ECSEL MASP 2019 Chapter 10; “Process Technology, Equipment, Materials and Manufacturing for electronic components and systems”, with emphasis on the following major challenge “the Extension of world leadership in Semiconductor Equipment, Materials and Manufacturing solutions” and “Developing Technology for heterogeneous System-on-Chip (SoC) Integration” of the ECSEL JU Annual Work Plan 2019. The relation of the IT2 project to world leadership regards the extension of the scaled semiconductor technology roadmaps and thereby maintain competence in advanced More Moore technology in Europe to support leading edge manufacturing. The relation of the IT2 project to the Developing Technology for heterogeneous System-on-chip Integration comes from activities regarding “System Scaling” in which technology is developed that enables wafer-to-wafer bonding creating 3D heterogeneous solutions with the aim to resolve performance limitations in power and data congestion. In regard to the annual work plan 2019, the IT2 project support the ECSEL JU objectives by contribution to the development of a strong and competitive Electronic Components and Systems (ECS) by involving many of the equipment and tool developers like; ASML, Zeiss, Thermo Fisher, Applied Materials, Nova, KLA along the value chain and knowledge institutes such as ARCNL, imec, PTB, TNO and TU/e. And by stimulating a dynamic ecosystem through through the involvement of SMEs like IBS, Recif, Reden and Unity.
Funded Companies:
| Company name | Funding amount |
| AMPHOS GmbH | €342,500 |
| APPLIED MATERIALS ISRAEL Ltd. | €0.00 |
| Applied Materials Belgium | €62,500 |
| Asml Belgium BVBA | €411,225 |
| Asml Netherlands B.V. | €3,000,000 |
| BRUKER TECHNOLOGIES Ltd. | €288,875 |
| CARL ZEISS SMT GmbH | €2,782,398 |
| Cadence Design Systems SAS | €84,685 |
| Cameca SAS | €212,500 |
| Coventor Sàrl | €288,500 |
| EV Group E. Thallner GmbH | €354,330 |
| FEI Electron Optics B.V. | €803,000 |
| Interuniversitair Micro-Electronica Centrum | €5,768,981 |
| Ion Beam Services | €282,525 |
| KLA-TENCOR CORPORATION (ISRAEL) | €1,030,305 |
| LAM Research Belgium | €0.00 |
| €346,697 | |
| Laser Systems & Solutions OF Europe | €134,900 |
| NOVA Ltd. | €806,000 |
| Nederlandse Organisatie Voor Toegepast Natuurwetenschappelijk Onderzoek TNO | €371,875 |
| PHYSIKALISCH-TECHNISCHE BUNDESANSTALT | €303,936 |
| Pfeiffer Vacuum | €184,304 |
| Prodrive Technologies B.V. | €263,035 |
| €0.00 | |
| Recif Technologies | €246,660 |
| €81,638 | |
| Semilab Felvezeto Fizikai Laboratorium Zrt. | €416,250 |
| Soitec LAB | €0.00 |
| Soitec SA | €677,460 |
| Spts Technologies Ltd. | €48,526 |
| €212,188 | |
| Technische Universiteit Eindhoven | €602,777 |
| Unity Semiconductor | €216,527 |
| €0.00 | |
| €206,289 |
Source: https://cordis.europa.eu/project/id/875999
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